What is FR-4

The process of cutting a glass-reinforced epoxy laminate (FR4) PCB is safe and can be done using the same techniques that are used for cutting prototype PCBs. One can use a sharp utility knife to score it and then break the pieces out. Another option is to use a Dremel cutting tool or saw.

FR4 and FR5 PCBs differ in their thermal properties. While FR4 has a Tg of 130° C (266° F) and a maximum operating temperature of 110° C (230° F), FR5 has a higher Tg of 160° C (320° F) and a maximum operating temperature of 140° C (284° F). Additionally, FR5 is thermally more consistent than FR4. It is worth noting that thin inner laminates for multi-layer boards are also made of FR4.

CEM-3 PCB is a close counterpart to FR4. It utilizes a ‘flies’ type of glass fabric instead of woven glass fabric. CEM-3 PCB stands out with its milky white color and smooth texture. It serves as a full substitute for FR4 and holds a significant market presence in Japan.

Im Vergleich zu normalen FR4-Leiterplatten zeichnen sich Aluminium-Leiterplatten durch eine bessere Wärmeableitung aus und sind in der Lage, die Wärme schnell abzuleiten. Nehmen wir das Beispiel eines Vergleichs zwischen einer 1,5 mm dicken FR4-Leiterplatte und einer Aluminium-Leiterplatte.

Das Leiterplattenmaterial FR4 eignet sich im Gegensatz zu FR1, FR2 oder FR3 besonders gut für Durchgangslöcher. Im Gegensatz zu diesen anderen Materialien stellt FR4 keine Herausforderungen oder Schwierigkeiten dar. Dies macht FR4 zu einer beliebten Wahl für die Herstellung verschiedener Lagen von Leiterplatten, von einlagigen bis zu mehrlagigen Leiterplatten.

There are alternative CEM materials available as replacements for FR4, such as CEM-1, CEM-2, and CEM-3. CEM-1 material is a combination of paper, woven glass epoxy, and phenol compounds, and it is particularly suitable for single-sided PCBs. It offers similar dielectric properties to FR4 while being more cost-effective.

FR4 is an abbreviation for Flame Retardant Level 4. It is a composite material that consists of glass fiber and epoxy, with copper foil laminated on one or both sides. On the other hand, Rogers substrate materials have varying compositions, with some utilizing a ceramic base instead of glass fiber.

Board manufacturers attach copper to FR4 by laminating the FR4 sheet with copper foil on both sides using adhesive. They then bond the laminated materials together with heat and pressure, resulting in the formation of a copper clad. This copper clad is subsequently utilized by PCB manufacturers to construct printed circuit boards.

FR4 material is a type of PCB laminate that is resin based and reinforced with glass. On the other hand, FR2 material has a similar appearance but uses laminated paper instead of glass. While FR2 is not as strong as FR4, it is less abrasive, resulting in longer tool life and lower cost. This makes FR2 a suitable choice for educational purposes.

Colored FR4 is offered in various shades including black, blue, yellow, and natural.

To desolder a through-hole component, start by placing the PCB on a flat and dry surface with the component side facing down. Then, switch on the soldering iron and adjust it to a temperature of 375 degrees Celsius.

2 layer PCB FR4 has a standard thickness of 1.6mm. It is expected that the PCB fabrication process includes copper clad cores, resulting in a total thickness of 1.6mm for the combination of copper and FR4 material.