PCB Fabrication

We use the data (Gerber file) you provide to create the production information for your customized boards. Our experts match your specifications with the capacities for compliance purposes.

When making circuit board, the imaging process is what defines the circuit traces. Traditional imaging process needs a UV-light and photo-tool to transfer images, while LDI only uses a computer-controlled, highly focused, laser beam to directly define the circuit pattern onto the board.

Leverage the etching process to eliminate any undesirable copper residues from the panel. After removal, we remove the dry film to remain with copper circuitry as well, which is in line with the PCB design.

Inspection of the circuitry against digital images to verify that the circuitry matches the design and that it is free from defects. Achieved through scanning of the board and then trained inspectors will verify any anomalies that the scanning process has highlighted.

Apply an oxide layer to the inner board layers and then stack them together using prepreg to create insulation between them.   Copper foil is added to the upper and lower stack parts.

Bore the holes that will later act as electrical contacts in the multilayer board. Drilling is a mechanical process that PCB manufacturers optimize to obtain registration to the internal layer links.

Apply thin copper layer deposits on the holes that drilled earlier on the walls. PTH offers copper deposits, which conceal the hole walls and the whole panel.

Outer layer imaging resembles the internal layering process. However, in outer layer drilling, get rid of the dry film and maintain the circuitry. Then plate the extra copper later in a clean environment.

The second electrolytic plating process, where we carry out extra plating in dry film parts (circuitry). After depositing the copper, we should apply tin to prevent the plated copper from oxidation.

Take out the dry blue film and scrape all the unwanted copper residues. The tin deposits resist the etching process to protect the copper deposit, then chemically eliminated the tin residues to leave behind the circuitry.

With the help of artwork and Ultraviolet light, expose some PCB parts and remove all the exposed parts. Then completely cure the remaining solder mask to create a quality finish.

Surface finish can maintain the exposed copper circuitry meanwhile provide a solderable surface when soldering components to the PCB. Metallic and organic are the two main kinds of surface finishes.

Test all boards before shipping to ensure all of the printed circuit boards are free of defects and meet the standards you expect. Test including flying probe, fixtureless testers. And we also have universal grid testing capability. These machines use fixtures built specifically for your PCB.

Route the PCB production panels into particular sizes and shapes according to the production file. PCB V-Scoring is a process of cutting a ‘V’ shaped groove at the top and bottom of a printed circuit board, leaving a thin layer between the Vees. Once we have done this, it can easily separate the PCB Board at the V by applying minimal pressure.

A team of sharp-eyed individuals scrutinizes each product. The process involves visually examining the board in line with the set standards.