One Stop PCBA Manufacturer/Glossary

PCB Glossary

Terms and glossary in PCB & PCBA industry.

Get Free Quote

A

Acceptance Quality Level (AQL)Acceptance TestAccess HolesAccuracyAcrylic ResinActivatingActive ComponentAdditive ProcessAdhesion LayerAdhesiveAgingAINAir GapAlgorithmAlkydAlN SubstrateAluminaAluminum PCBAmbientAmerican National Standards Institute (ANSI)American Wire Gauge (AWG)Analog CircuitAnalog Circuit SimulatorAnalog Functional TestAnalog In-circuit TestAnalytical Services LabAnchoring SpurAnnotationAnnular RingAnodeAnti-Solder BallAny Layer Interstitial Via Hole (ALIVH)ApertureAperture InformationAperture ListAperture TableAperture WheelAqueous CleaningArc ResistanceArrayArray RailsArray X DimensionArray Y DimensionArtworkArtwork MasterAS9100ASCIIASCII TextAspect RatioAssemblyAssembly DrawingAssembly FileAssembly HouseAssembly LanguageASTMATEAuto RouterAutoCADAutomated Component InsertionAutomated Optical Inspection (AOI)Automated Test Equipment (ATE)Automatic Component PlacementAutomatic X-Ray Inspection (AXI)Axial LeadAzeotrope

B

B-StageB-Stage MaterialB-Stage ResinBack DrillingBackdrivingBackpanel (Backplane)Backup MaterialBall Grid Array (BGA)Bare BoardBare Board Test (BBT)BarrelBaseBase CopperBase Copper WeightBase LaminateBase MaterialBase Material ThicknessBase SolderabilityBasic WettabilityBeam LeadBed of NailsBed of Nails FixtureBellows ContactBevelBeveled EdgeBevelingBGA AssemblyBill of MaterialsBill of Materials (BOM)Black PadBlind ViaBlisterBlow HoleBluetoothBlutter CoatBoardBoard DensityBoard HouseBoard ThicknessBoard Type (Single Unit and Panel)Board VendorBody GoldBond Lift-offBond StrengthBonding LayerBonding TimeBorder AreaBorder DataBottom SMD PadBoundary ScanBowBranched ConductorBrazing AlloyBreak-awayBreakdown VoltageBreakoutBridged JointBridgingBT-EpoxyBuild Time (Lead Time)Build-upBuildabilityBuilt-In Self-Test (BIST)BulgeBuried Resistance BoardBuried ViaBurn-inBurrBusBus BarBypass Capacitor

C

C-StageC-Stage ResinC4CableCAD fileCAD systemCAM FileCAM HoldCapacitanceCapacitive CouplingCapillary ActionCaptureCard-Edge ConnectorCast AdhesiveCastellated HoleCatalystCathodeCavity ProcessCEM-1Center to Center SpacingCeramic Ball Grid Array (CBGA)Chip On Board (COB)Circuit Card Assembly (CCA)ClearanceCoefficient of ExpansionComponent DensityComponent KittingComposite Epoxy Material (CEM)Computer Aided Design (CAD)Computer Aided Manufacturing (CAM)Computer Assisted Engineering (CAE)Conductive Anodic Filament (CAF)Conductive PatternConductor SideConductor ThicknessContact ResistanceCopper Clad Laminate (CCL)Core ThicknessCosmetic DefectCounterbored HoleCountersinkCSPCurrent Carrying Capacity

D

DatabaseDatumDelaminationDesign for Assembly (DFA)Design Width of ConductorDesktop StencilDezincificationDiodeDouble-Sided BoardDraw

E

Electronic ComponentEnd-to-end Design

F

Flip ChipFlux ResidueFlying Probe TesterFootprintForced-Air Convection

G

Gerber FileGIL Grade MC3DGold/Nickel Plating

I

ImpedanceIndividual Route

K

Kapton

L

Leakage CurrentLifted LandLoss Tangent

M

Manhattan LengthMinimum Conductor WidthMolded Carrier Ring (MCR)

P

Panel PlatingPCB HousePCBA TestingPCBA TestingPitchPrinted Circuit Board Assembly (PCBA)

S

Solder BallsSurface Mount Technology (SMT)

T

Tooling HoleTraces and SpacesTurnkey Service

V

Via Filling

W

Warping

Z

Zip File
en_USEnglish
en_USEnglish