What is Landless Hole
A landless hole, padless plated hole or landless via, is a type of plated-through hole that does not have any land or copper pad surrounding it, except at the point where the trace enters the hole. This innovative technology eliminates the need for an annular ring or pad around the hole, allowing for more efficient utilization of space on the PCB.
The landless hole technology is achieved through the use of positive acting photoresist, which reduces spacing constraints and enables larger scale PCB real estate. By eliminating the need for a pad, the landless hole technology offers streamlined PCB stack-ups with state-of-the-art capability. It provides higher routing density, allowing for more traces per layer and reducing the total number of layers required for the PCB stack-up.
One of the key advantages of landless holes is their improved reliability compared to pad-based versions. Studies conducted by HP have shown that the use of landless holes does not sacrifice performance and offers enhanced reliability. Additionally, the cost impact of adding layers to the PCB stack-up is minimal, making landless holes a cost-effective option for companies seeking to enhance performance and innovation in their electronics products.