Blog

Moisture can hide in a sealed Moisture Barrier Bag and turn into steam during reflow, causing internal delamination that is not visible from the outside. The Humidity Indicator Card is the only reliable witness; ignore lavender or borderline readings and you risk field failures, while careful low-temperature baking and disciplined floor life management protect solderability.

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Procurement is an engineering discipline that guards performance and availability in todays allocation era. This guide explains why exact part matches fail under DC bias, how parametric rigor and authorized provenance protect boards, and why designing for availability is the only path to reliable electronics.

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Long PCBs bow and even fail mid-process as copper and FR4 expand at different rates and gravity sags the center. The remedy is mechanical support, such as center board supports or rigid pallets, to keep the board flat through the heat cycle.

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At Bester we treat solder mask as a precision dam, not paint. This deep dive explains how default mask expansions can cause bridges on fine pitch pads, why fab margins cost reliability, and how LDI and careful web control protect yields.

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Bester explains castellated module failures stem from CTE mismatch and brittle solder joints. Relying on datasheet footprints invites fatigue; the fix is toe extension, stencil overprint, and mindful edge placement to survive real-world environments.

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Shiny joints on heavy copper busbars can hide internal defects. This article shows why preheat soak and longer dwell are essential for reliable high-mass soldering, how inerting and flux choices protect the joint, and why cross-section checks confirm true hole fill.

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