Blog

The ghost failure on press-fit connectors shows up after a flawless factory run: field returns reveal pins loosening due to thermal cycling, humidity, and harsh handling. It’s the pin, the hole, and the board that betray you long after turnup.

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Visually perfect boards can still fail in the field due to invisible ionic contamination trapped under components, causing leakage and parasitic power loss. Relying on bulk ROSE tests masks local hotspots, so the industry must adopt localized forensics and targeted cleaning to prevent recalls.

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MEMS sensors may pass factory ICT tests but drift weeks later due to hidden moisture delamination. This piece explains the failure mechanism inside MEMS packages, why bake cycles fail, and the strict pre-oven discipline needed to prevent costly field recalls.

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Counterfeit components threaten safety and reliability, especially in medical and avionics. This field guide to incoming inspection outlines forensic checks from paperwork autopsy to X-ray verification, solvent tests, and real-world tossouts to prevent costly failures.

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Solder beads under RF shield walls can quietly derail a module after field cycles. This article shows how aperture design, reduced paste, and mindful layout stop bead formation, preventing leaks, shorts, and reliability failures from vibration and thermal cycling.

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sealed electronics fail from silicone outgassing inside the enclosure, laying a nanoscopic glass layer on contacts and killing relay function. the article explains why electronic grade silicone is not a cure and points to urethane or epoxy alternatives and strict outgassing tests like astm e595 as the right spec.

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