What is Delamination
Delamination, in the PCB industry, refers to the separation or detachment of the layers that make up a printed circuit board. It occurs when the layers, particularly the laminate material, become physically separated from each other. This separation can be observed during visual inspection and can happen on the surface of the PCB or within the internal layers.
Delamination in the internal layers of the PCB can lead to various malfunctions and issues. It can cause interference and disruptions to the functioning of the circuits, resulting in circuit malfunctions. Additionally, delamination has visual implications as it produces blister spots on the surface of the PCB, which can be easily identified during visual inspection.
Delamination is considered a defect in the PCB manufacturing process and can be caused by factors such as improper handling, poor material quality, inadequate bonding, thermal stress, or exposure to moisture and other environmental factors. To prevent and address it, PCB manufacturers implement stringent quality control measures, use high-quality laminate materials, ensure proper bonding and adhesion between layers, and conduct thorough inspections and testing throughout the manufacturing process.
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