What is Laser Drilling
Laser drilling, or laser ablation, is a precise and controlled process used to create holes on a PCB for establishing connections between different copper layers. This technique utilizes a highly concentrated laser beam, which is a focused and intense beam of light, to remove material from the surface of the PCB.
Laser drilling has the ability to achieve greater precision and control compared to mechanical drilling methods. This makes it particularly useful in the production of high-density interconnect (HDI) boards found in modern electronic devices. Laser drilling can create smaller and more intricate holes, enabling the miniaturization of electronic components.
Another advantage is its non-contact nature. Unlike mechanical drilling, there is no physical contact between the laser and the PCB surface. This eliminates the risk of mechanical damage to the board and reduces wear and tear on the drilling equipment. It also allows for drilling on delicate and sensitive materials without causing any distortion or deformation.
Laser drilling offers flexibility in terms of hole shape and angle. The laser beam can be precisely controlled to create holes with different shapes, such as round, oval, or rectangular. It can also drill at various angles, allowing for the creation of holes that are not perpendicular to the PCB surface.
The laser drilling process involves focusing the laser beam onto the surface of the PCB. The intense energy of the laser vaporizes the material, creating a hole. The size and depth of the hole can be controlled by adjusting the laser parameters, such as power, pulse duration, and repetition rate.