What is Chemically-deposited Printed Chip on Board
Chemically-deposited printed chip on board refers to a process that involves the deposition of a thin layer of copper, approximately 1 micron thick, onto the surface of the PCB panel using a chemical deposition method. This process is typically carried out after the PCB panel has been cleaned and prepared.
During the chemical deposition process, the copper layer is carefully applied over the entire surface of the panel, including the drilled holes. The copper flows into the holes, ensuring that the walls of the holes are completely plated with copper. This deposition process is computer-controlled, ensuring precision and accuracy.
The purpose is to enhance the conductivity and connectivity of the PCB. By depositing a thin layer of copper, it helps to establish reliable electrical connections between components and traces on the PCB. This process plays a crucial role in the overall functionality and performance of the PCB.