What is Die Bonder
A die bonder is a specialized machine used in the process of die bonding. die bonding involves attaching a semiconductor die or chip onto a substrate or package, ensuring the proper electrical and mechanical connection. The die bonder is designed to accurately pick up the die and place it onto the substrate with precision. Die bonders enable the precise placement and bonding of IC chips onto substrates or PCBs. The type of die bonder used can vary depending on specific requirements, such as die size, automation level, and desired throughput.