What is Edge Dip Solderability Test
The edge dip solderability test is a testing method to assess the solderability and reliability of a printed circuit board. This test is considered a destructive testing method, conducted to ensure the quality and reliability of the PCB. It verify the absence of delamination on the PCB after the test. Delamination refers to the separation of layers within the PCB, which can lead to issues such as reduced electrical conductivity and mechanical strength.
While the testing methods for solderability may vary slightly among manufacturers, the two common methods are: the solder float experiment and the edge dip test. The solder float experiment involves floating the specimen on the surface of a solder bath maintained at 260 +/- 5°C for 4-5 seconds. On the other hand, the edge dip test entails dipping the specimen in a solder bath maintained at 288 +/- 5°C for 10 seconds, with the operation repeated 2-3 times.
The edge dip solderability test specifically focuses on the dipping method, where the PCB specimen is immersed in the solder bath. This test aims to evaluate the solderability and reliability of the edges of the PCB. By subjecting the edges to the solder bath, the test assesses the PCB’s ability to maintain proper solder adhesion and prevent delamination at the edges.