What is Fine Pitch
Fine pitch is a type of PCB assembly technology used for integrated circuit (IC) packages. It is characterized by small leads and a fine spacing between these leads. Fine Pitch packages typically have lead spacings of 0.65mm (26mil) or less.
Fine pitch technology emerged in the 1990s as a significant advancement in PCB assembly. It offers both size and cost savings compared to other assembly methods. This technology is considered an essential link in the evolutionary chain of PCB assembly techniques.
However, the acceptance of fine pitch packages has not been universally accelerated despite the proliferation of different types of these packages. This may be due to the complexities and challenges associated with manufacturing and assembling components with such tight spacing.