What is Hole Pull Strength
Hole pull strength is the amount of force required to rupture a plated-through hole or its surface terminal pads when pulled in the direction of the hole’s axis. This measurement is typically expressed in pounds and is determined by applying a controlled pull force to a wire soldered in the hole. The rate at which the force is applied, measured in inches per minute, is also taken into consideration.
The hole pull strength test is a quality control measure in PCB manufacturing. It helps assess the mechanical reliability and durability of the connections between components and the PCB. By measuring the hole pull strength, manufacturers can identify any weak points or potential failures in the PCB assembly, allowing them to address and improve upon these issues.
The design of the plated-through hole, the quality of the solder joint, the type and thickness of the plating material, and the material properties of the PCB substrate can influence the hole pull strength. Manufacturers must carefully consider these factors and ensure they meet the required standards and specifications to achieve the desired Hole Pull Strength.