What is Bonding Layer
A bonding layer is an adhesive layer used during the lamination process to bond together discrete layers of a multi-layer printed board. This layer ensures the electrical connectivity and mechanical stability of the PCB. It securely joins the different layers, creating a strong and reliable bond.
The bonding layer acts as a medium between the layers, providing a cohesive force that holds them together. It is typically made of an adhesive material that possesses the necessary properties to withstand the lamination process and maintain its integrity throughout the lifespan of the PCB. The choice of bonding layer material is essential, as it directly impacts the overall quality and performance of the PCB.
During the lamination process, the bonding layer is applied between the layers of the PCB, and pressure and heat are applied to facilitate the bonding. This process ensures that the layers are firmly attached to each other, creating a unified structure. The adhesive properties of the bonding layer allow for the transmission of electrical signals between the layers, enabling the proper functioning of the PCB.