What is C-Stage Resin
C-Stage resin is the final stage of the curing process for certain thermosetting resins. During this stage, the resin polymer undergoes a chemical reaction and reaches its solid and final state of cure. It is characterized by a high molecular weight and becomes mostly insoluble and infusible.
The purpose of C-Stage resin in PCB manufacturing is to provide insulation and protection to the components and conductive traces on the PCB. It acts as a protective layer, ensuring the integrity and functionality of the electronic device.
The curing process of thermosetting resins involves the use of a curing agent, which triggers the polymerization and hardening of the resin. Once the resin has reached the C-Stage, it has fully cured and solidified, creating a durable and stable material for the PCB.