What is Heat and Pull
Heat and pull is a de-soldering method that involves the use of a specialized device that grasps, heats, and pulls the leads or components that need to be removed from a PCB. This technique is useful when dealing with soldered connections that need to be replaced or repaired.
During the heat and pull process, the device applies heat to the solder joints, causing the solder to melt and become malleable. The device then gently pulls on the leads or components, separating them from the PCB without causing damage to the surrounding circuitry.
This method is preferred in situations where traditional de-soldering techniques, such as using a soldering iron or a hot air rework station, may not be suitable or effective. Heat and Pull allows for precise and controlled removal of components, minimizing the risk of overheating or damaging the PCB.