What is Ceramic Ball Grid Array (CBGA)
A Ceramic Ball Grid Array (CBGA) is a type of package characterized by the use of a ceramic material as the substrate, onto which a grid or array of solder balls is attached on the bottom surface. This arrangement allows for efficient heat dissipation, making CBGA packages ideal for applications that require effective thermal management.
CBGA packages offer high packaging density, meaning they can accommodate a large number of interconnects within a compact space. The ceramic material used in CBGA packages provides excellent thermal conductivity, allowing for efficient heat transfer away from the components. This is particularly important in electronic devices that generate a significant amount of heat during operation.
However, CBGA packages may have thermal compatibility issues with PCBs. The coefficient of thermal expansion (CTE) of the ceramic material used in CBGA packages may not match that of the PCB material. This difference in CTE can potentially lead to thermal stress and reliability issues, especially during temperature cycling or rapid temperature changes.
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