What is Interconnect Stress Test
The interconnect stress test (IST) is a widely used test methodology for evaluating the reliability and integrity of interconnects within a PCB. This test method involves subjecting the PCB to various forms of stress, such as mechanical, thermal, or electrical stress, to simulate real-world conditions and identify any potential issues or weaknesses in the interconnects.
IST offers several advantages over traditional methods, including speed, repeatability, reproducibility, and ease of characterization. It provides a more realistic assessment of the reliability of PWB (Printed Wire Board) interconnections by simulating the products’ expected assembly and rework conditions. This makes IST a valuable tool for assessing the performance and quality of PCB interconnects.
IST has the ability to effectively evaluate the integrity of Plated Through Holes (PTH) and identify the presence and levels of post separations within multilayer boards. PTH refers to the conductive pathways that connect different layers of a PCB, and post separations are separations or gaps that occur between the layers after the manufacturing process.
By subjecting the PCB to accelerated stress testing, IST aims to uncover the initial failure mode or mechanism of the interconnects. The data obtained from IST is recorded as cycles to failure, providing valuable insights into the reliability and durability of the interconnects.