Blog

Pairing no-clean flux with acrylic or urethane conformal coatings can lead to predictable field failures in humid conditions. Though designed to be inert, the flux residues become electrochemically active when trapped with moisture under the coating, accelerating corrosion and dendritic growth instead of preventing it.

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While full in-circuit testing (ICT) is the gold standard for high-volume production, its steep fixture costs and long lead times are prohibitive for low-volume runs. For production under 300 units, a smarter strategy combines boundary scan, vectorless testing, and functional tests to achieve excellent fault coverage without the economic and logistical burden of custom fixtures, enabling faster, more flexible manufacturing.

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Over-investing in lot traceability for medical assemblies creates the illusion of control without proportional risk reduction. The key is to calibrate traceability depth based on risk, matching the system’s granularity to the consequences of failure. This ensures a defensible, efficient system that enables targeted action during a recall without stalling production or burying teams in data noise.

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At Bester PCBA, we solve the challenge of micro-BGA assembly by moving beyond conventional methods. Our systematic approach integrates vacuum reflow to eliminate voiding, precision stencil design for accurate paste deposition, and specialized solder paste to achieve consistent, sub-one-percent defect rates, engineering quality directly into the process.

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Your IoT product’s wireless range can be compromised during manufacturing. Antenna detuning, caused by material contamination, dielectric shifts, and ground plane disruption during assembly, silently degrades RF performance. At Bester PCBA, we enforce a system of four manufacturing disciplines—from keepout zone compliance to validated test jig design—to ensure your device’s RF performance matches its design intent, preventing costly field failures.

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Soldering heavy copper PCBs presents a significant thermal management challenge, not a skill problem. The massive thermal inertia of copper planes starves joints of heat, leading to cold joints and field failures. At Bester PCBA, we overcome this by treating it as a physics problem, using aggressive preheating and tailored process profiles to ensure robust, reliable intermetallic bonds for high-current applications.

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