Blog

Heavy components like capacitors are prone to failure from vibration in automotive environments. Manual staking with silicone is unreliable; only automated dispensing of engineered adhesives provides the required structural support to ensure long-term reliability.

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Treating a solder paste stencil as a simple 2D copy of your board’s pads is the most common cause of assembly defects. Manufacturing success depends on understanding the Z-axis—the solder volume—and engineering the stencil with features like steps and window panes to account for the physics of paste deposition.

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When assembling double-sided PCBs, gravity threatens to pull heavy components off the bottom side during reflow soldering. This article explores the physics behind this risk and outlines the only effective solutions, from superior design choices to manufacturing fixtures and the pitfalls of using adhesives.

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Relying on a distributor’s ‘compatible’ or ‘drop-in replacement’ flag for alternate components is a costly mistake. Seemingly minor differences in mechanical dimensions or electrical characteristics, not shown in search filters, can lead to catastrophic failures on the assembly line.

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Your PCB’s final cost is not determined by its size, but by how many units fit onto a standard manufacturing panel. An arbitrary 2mm change in your board’s dimensions can increase yield by 33%, directly impacting your bottom line by reducing wasted material.

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High-current PCB design often fails during manufacturing. The massive copper planes needed to carry amps act as heat sinks, preventing reliable solder joints and causing catastrophic field failures. Learn why direct connections are a myth and how to correctly calculate thermal reliefs to balance current capacity with manufacturability.

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