Blog

Component shortages often stem from preventable BOM fragilities, not unavoidable supply chain issues. By implementing systematic BOM health checks, establishing multi-source resilience through parametric qualification, and proactively monitoring component lifecycles, you can build a robust BOM that bends under supply pressure instead of breaking, ensuring production continuity.

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Many assume the strict regulatory discipline of ISO 13485 must slow down medical device PCBA manufacturing. This is a myth. When a quality management system is built into the core of operations, the very mechanisms that ensure traceability and repeatability, like real-time Device History Records and validated processes, become the enablers of speed and efficiency, eliminating delays and ensuring continuous audit readiness.

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Hidden solder joints under dense BGA packages pose a significant verification challenge. At Bester PCBA, we use a dual methodology of Automated X-ray Inspection (AXI) to assess structural quality and on-bench power cycling to validate performance under stress. This combined approach ensures both structural integrity and functional robustness, drastically reducing the risk of latent defects reaching customers.

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The push for miniaturization has made 0402 passives a default choice, but this decision carries hidden costs in rugged applications. For electronics exposed to vibration and thermal stress, the slightly larger 0603 component offers superior reliability and a lower total cost of ownership by mitigating risks like tombstoning, solder joint fatigue, and costly rework.

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Protecting PCBAs in harsh environments requires a proven strategy. We explore the core ruggedization methods—potting, staking, and conformal coating—and explain why the choice of chemistry is the most critical decision for long-term reliability. Our approach favors simple, field-tested solutions to protect against vibration and thermal stress.

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RoHS exemptions for leaded BGAs are ending, forcing hardware teams to migrate to lead-free alternatives. This is not a simple paperwork exercise but a significant reliability event, as lead-free alloys behave differently under thermal and mechanical stress, requiring a methodical plan for design, manufacturing, and validation to avoid costly field failures.

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