Blog

Relying on a distributor’s ‘compatible’ or ‘drop-in replacement’ flag for alternate components is a costly mistake. Seemingly minor differences in mechanical dimensions or electrical characteristics, not shown in search filters, can lead to catastrophic failures on the assembly line.

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Your PCB’s final cost is not determined by its size, but by how many units fit onto a standard manufacturing panel. An arbitrary 2mm change in your board’s dimensions can increase yield by 33%, directly impacting your bottom line by reducing wasted material.

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High-current PCB design often fails during manufacturing. The massive copper planes needed to carry amps act as heat sinks, preventing reliable solder joints and causing catastrophic field failures. Learn why direct connections are a myth and how to correctly calculate thermal reliefs to balance current capacity with manufacturability.

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If solder won’t wet your battery holder, you’re likely fighting a stubborn nickel oxide layer, not failing at technique. Discover why more heat is the wrong approach and how to properly prepare the surface with aggressive flux or abrasion for a strong, reliable bond.

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A partial reel of electronic components exposed to air is a ticking time bomb. The physics of moisture absorption can cause catastrophic failures during manufacturing, a phenomenon known as popcorning. Understanding and implementing a strict vacuum-sealing protocol is the only way to prevent costly scrap and ensure reliable products.

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The “Golden Sample” from your contract manufacturer proves a design can work, but it doesn’t prove the manufacturing process is stable for mass production. Relying on a simple “Pass/Fail” FAI report is a trap that hides process flaws and leads to costly production failures.

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