Blog
-
The Unseen Conflict of Mixed-Technology Assembly
An engineer looking to modernize a legacy circuit board often sees a clear path forward. By retrofitting a classic through-hole (THT) design with modern surface-mount (SMT) components, a product can gain new functionality and shrink in size.
-
The Obsolescence Mismatch: Navigating Component Lifecycles in Long-Term Hardware
A fundamental tension exists at the heart of industrial, medical, and aerospace manufacturing. The equipment itself is built to endure, with commitments for service and support that stretch across decades.
-
Choosing a Conformal Coating for Harsh Environments
A printed circuit board is an object of pure logic, a landscape of order designed to function within predictable parameters. Yet, many of these boards are destined for a world of chaos.
-
The Solder Joint’s Secret Life
An electronic assembly can leave the production line in a state of perfect deception. It passes every electrical test, its components are placed with robotic precision, and to the naked eye, it is flawless.
-
The Hidden Liability in Your Component Reels
For the teams managing procurement and inventory, the most consequential risks are rarely the most obvious. A greater threat than a delayed shipment or a pricing error often lies dormant, sealed inside the reels of seemingly perfect electronic components.
-
The Anatomy of a BGA Failure
A prototype board arrives, inert and useless. For the product development team, this is more than a delay; it is a cycle of frustrating debugging, compromised data, and mounting costs.
