Blog

Low-volume hardware production demands flexible, cost-efficient test strategies over “perfect” coverage. Instead of pricey fixed fixtures, using firmware-based functional tests and simple human-centric setups ensures reliable manufacturing without bankrupting your run.

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On the factory floor, cables designed in CAD can snap under real world stress. This reality check explains why deterministic routing, service loops, and solid strain relief prevent field failures in box builds.

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IPC pass fail masks real risk when voids sit under the die. Bester argues that thermal path integrity and 3D inspection beat total void percentages, guiding smarter grading to prevent failures and recalls in high power electronics.

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Sealed optical modules can pass electrical tests yet fog the lens with volatile residues that outgas inside the enclosure. True image quality demands true optical cleanliness: localized sensor-area testing and IC-level checks rather than blanket ROSE or blanket washes.

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260c for 10 seconds is a dangerous simplification. Reflow stresses, CTE mismatch, and moisture can warp connectors and lift pins even when solder seems fine; choose stable materials like LCP and add mechanical fixes to survive real manufacturing.

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Ultra-low power devices rarely fail from the battery; they fail from the board, where hidden flux residue becomes conductive in humidity and creates a parasitic drain. A proper inline wash and ion chromatography proof can reclaim years of battery life.

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