Blog
Read our blogs and insights on PCB and PCBA industry.
Blog
-
The “Golden Unit” is a Myth: Preventing PCBA Revision Drift
Revision drift is the silent enemy of hardware, Bester notes. When production documentation loosens, the AVL, BOM, and assembly drawings drift and field failures follow.
-
The Hidden Cost of “Forever” Glue: A Field Guide to Underfill Strategy
A field guide to underfill choices reveals how capillary flow, Tg, and corner bonding influence repairability and cost. The wrong material can turn repairs into scrap, while the right strategy preserves yield and lowers total ownership.
-
The Entropy of Invoices: Why Revision Collisions Kill Yield
Revision collisions derail manufacturing lines when ECOs arrive out of sync, producing the wrong units and wasted time. The article traces how linked revisions, waivers, and firmware vs hardware changes create soft yield loss and argues for a hard, clean break to protect margins.
-
Staking Versus Epoxy: Ruggedization Choices That Decide Long-Term Repairability
Rugged boards should survive harsh environments, but thick epoxy potting often backfires by trapping heat and stressing solder joints. The article argues for surgical staking with compliant materials to protect components while preserving repairability.
-
The Golden Coupon Paradox: Why Passing Reports Hide Failing Boards
The Golden Coupon paradox shows a passing CoC can hide a failing board, because coupons that mirror only easy geometry miss the hard truth and invite field recalls.
-
The Geometry of Failure: Why Castellated Modules Crack in the Field
Bester explains that castellated joint failures stem from geometry, not bad parts, and appear under vibration and thermal cycling. The guide shows how extending pads to form a strong heel fillet, trimming stencil apertures, and validating joints for lean production improves field reliability.
English 
German 
Arabic 
French 
Spanish 
Portuguese (Portugal) 
Korean 
Indonesian 
Chinese 
Russian 
Italian 
Dutch 
Polish 
Hindi 
Thai 
Portuguese (Brazil)