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Traditional PCB fabrication workflows fail due to communication breakdowns, where non-technical brokers cause massive delays. By enabling direct access between designers and CAM engineers, you can resolve issues in minutes instead of days, eliminating administrative dwell time and ensuring your project stays on schedule.

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When odd-form components threaten manufacturing speed, selective soldering is often a trap. Custom wave solder pallets, designed with a deep understanding of fluid dynamics and material science, are the key to converting a slow serial process back into a parallel one, maximizing throughput.

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Relying on flying probe testers for mass production seems like a clever way to avoid high upfront fixture costs, but it’s a trap. This common mistake creates a critical throughput bottleneck that slows your entire production line, inflates unit costs, and ultimately costs far more than the bed-of-nails fixture you tried to avoid.

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Heavy components like capacitors are prone to failure from vibration in automotive environments. Manual staking with silicone is unreliable; only automated dispensing of engineered adhesives provides the required structural support to ensure long-term reliability.

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Treating a solder paste stencil as a simple 2D copy of your board’s pads is the most common cause of assembly defects. Manufacturing success depends on understanding the Z-axis—the solder volume—and engineering the stencil with features like steps and window panes to account for the physics of paste deposition.

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When assembling double-sided PCBs, gravity threatens to pull heavy components off the bottom side during reflow soldering. This article explores the physics behind this risk and outlines the only effective solutions, from superior design choices to manufacturing fixtures and the pitfalls of using adhesives.

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